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Nordic Semiconductor to showcase nRF9160 SiP cellular IoT module at Mobile World Congress (MWC) Shanghai 2019
Nordic’s solutions for cellular IoT and low power wireless mesh will be among the exhibits at major mobile event in Shanghai
Nordic Semiconductor announces it participation in Mobile World Congress (MWC) Shanghai 2019, Asia’s leading event for next-generation communications technology—including 5G, cellular IoT, AI, big data, and more—from June 26 to 28. As a leader in wireless IoT solutions, Nordic will be showcasing its latest hardware, software and development tools at booth E100, Hall N2, in the Shanghai New International Expo Center (SNIEC).
Featured will be Nordic’s nRF9160 leveraging System-in-Package (SiP) technology to achieve a size of just 10 by 16 by 1mm in dimension that represents the smallest form-factor ever seen in the cellular IoT module industry to date (up to 3x smaller footprint, up to 2x thinner, and up to 5x less total packaging volume) than competing products. The nRF9160 SiP integrates an Arm Cortex-M33 host processor, GPS, plus all the components required for cellular IoT operation (including a multimode cellular modem and transceiver, RF front end, dedicated application processor, Flash memory, RAM memory, power management, plus crystal and passive components on a single chip).
"The debate about which communications platforms and protocols best support the development of the IoT is ongoing," says Wendell Boyd, Director of Sales and Marketing, APAC, at Nordic Semiconductor. "Nevertheless, LTE-M and NB-IoT have emerged as key technologies for the cellular IoT, and our nRF9160 SiP marks a major milestone in transforming design theory into engineering practice. We look forward to talking about it with the local design community."
Featured will be Nordic’s nRF9160 leveraging System-in-Package (SiP) technology to achieve a size of just 10 by 16 by 1mm in dimension that represents the smallest form-factor ever seen in the cellular IoT module industry to date (up to 3x smaller footprint, up to 2x thinner, and up to 5x less total packaging volume) than competing products. The nRF9160 SiP integrates an Arm Cortex-M33 host processor, GPS, plus all the components required for cellular IoT operation (including a multimode cellular modem and transceiver, RF front end, dedicated application processor, Flash memory, RAM memory, power management, plus crystal and passive components on a single chip).
"The debate about which communications platforms and protocols best support the development of the IoT is ongoing," says Wendell Boyd, Director of Sales and Marketing, APAC, at Nordic Semiconductor. "Nevertheless, LTE-M and NB-IoT have emerged as key technologies for the cellular IoT, and our nRF9160 SiP marks a major milestone in transforming design theory into engineering practice. We look forward to talking about it with the local design community."
LTE-M and NB-IoT have emerged as key technologies for the cellular IoT, and our nRF9160 SiP marks a major milestone in transforming design theory into engineering practice.
Wendell Boyd, Nordic Semiconductor
Nordic will also be showcasing its award winning nRF52840 System-on-Chip (SoC). The nRF52840 SoC is a Bluetooth® Low Energy (Bluetooth LE)/Bluetooth 5-, Thread 1.1-, and Zigbee PRO (R21) and Green Power proxy specification-certified product. The SoC employs a 64MHz, 32-bit Arm® Cortex™ M4F processor which has ample generic processing power, Floating Point, and DSP performance to meet the demands of even the most challenging wireless applications. The SoC features a radio architecture with an +8 dBm on-chip PA; 1MB Flash and 256 kB RAM; a full speed USB 2.0 controller, and a host of peripherals. The SoC also incorporates an Arm CryptoCell-310 cryptographic accelerator for best-in-class security.
Also on display in Shanghai will be Nordic’s recently released nRF52811 SoC that brings greater levels of accessibility for applications that would benefit from advanced wireless IoT capabilities such as location accuracy. Earlier this year, the Bluetooth Special Interest Group (SIG) released version 5.1 of the Bluetooth Core Specification that supports a new feature called Direction Finding which enhances the accuracy of real-time locationing services (RTLS) and indoor positioning systems, and is supported by the nRF52811 SoC. The SoC’s Bluetooth 5.1 Direction Finding enables positioning solutions to not only rely just on received signal strength indicator (RSSI), but also the actual direction of a signal. This improves accuracy significantly and opens up new applications.
For more information, visit our event page.
Also on display in Shanghai will be Nordic’s recently released nRF52811 SoC that brings greater levels of accessibility for applications that would benefit from advanced wireless IoT capabilities such as location accuracy. Earlier this year, the Bluetooth Special Interest Group (SIG) released version 5.1 of the Bluetooth Core Specification that supports a new feature called Direction Finding which enhances the accuracy of real-time locationing services (RTLS) and indoor positioning systems, and is supported by the nRF52811 SoC. The SoC’s Bluetooth 5.1 Direction Finding enables positioning solutions to not only rely just on received signal strength indicator (RSSI), but also the actual direction of a signal. This improves accuracy significantly and opens up new applications.
For more information, visit our event page.
