Nordic chip-scale Bluetooth LE solution enables module to satisfy complex wireless applications
2017
MtM Technology Corporation’s M905 AoP module employs wafer-level chip scale package variant of Nordic’s nRF52832 SoC allowing manufacturers with limited RF experience to easily develop compact, sophisticated wireless products.
Nordic Semiconductor today announces that Taiwan-based MtM Technology Corporation has selected Nordic’s nRF52832 Bluetooth® Low Energy System-on-Chip (SoC) for its M905 Antenna-on-Package (AoP) module. The M905 is a fully integrated, ultra low power Bluetooth LE module designed to enable a wide range of sophisticated wirelessly-connected products with a ‘plug-and-play’ solution that can lower development costs and speed time-to-market.
The module employs the 3 by 3.2mm wafer-level chip scale package (WL-CSP) variant of Nordic’s nRF52832 SoC, which alongside MtM’s System-in-Package (SiP) technology results in a 6.5 by 6.5mm form factor and makes the module suitable for a wide range of space-constrained, low power applications, for example wearables or standalone devices offering voice control, pattern recognition, or environmental learning functionality.
The M905 allows product manufacturers to speed up development, production, and time-to-market of demanding Bluetooth 4.2-enabled applications, without the customer requiring any RF design expertise. The module includes an integrated antenna, along with a full range of programmable on-chip analog and digital peripherals.
Nordic’s nRF52832 Bluetooth LE SoC, a member of Nordic’s sixth generation of ultra low power (ULP) wireless connectivity solutions enables the module to power even the most complex, processor-intensive wireless applications.
The nRF52832 SoC has been engineered to minimize power consumption with features such as the 2.4GHz radio’s 5.5mA peak RX/TX currents and a fully-automatic power management system that reduces power consumption by up to 80 percent compared with Nordic’s nRF51 Series SoCs. The result is a Bluetooth LE solution which offers 58 CoreMark/mA, up to twice as power efficient as competing devices.
“The nRF52832 SoC was a natural choice for us,” says Cedric Lam, MtM Technology Corporation, Chief Technology Officer. “The tiny WL-CSP is the smallest package on the market which includes such a powerful processor and rich I/O support. Moreover, power consumption—which is crucial to our customers—is among the lowest in the market. And the integrated NFC-A tag for easy pairing reinforced our decision.
“Our experience both in terms of technical and business support is a key reason why we continue to work with Nordic.”
The M905 will also be available as a Development Kit board, allowing the module to be interfaced with MtM’s existing range of sensor boards.
